项目 |
正片流程 |
||
最小 |
最大 |
||
成品板厚 |
0.4mm |
3.5mm |
|
钻咀孔径 |
0.2mm |
6.50mm |
|
钻孔孔径公差(指成品) |
PTH:±3mil/NPTH: ±2mil |
● |
|
钻孔孔位公差(指成品) |
±3mil |
● |
|
孔壁粗糙度 |
● |
<1000μ" |
|
钉头 |
● |
<75% |
|
槽刀 |
0.6mm |
○ |
|
板厚孔径比 |
● |
≦8:1 |
|
孔铜厚均勻性 |
80%以上 |
||
外层线宽(原稿)mil |
4 |
● |
|
外层线距(原稿)mil |
4 |
● |
|
线宽公差 |
±20% |
● |
|
绿油对准度 |
+/-3mil |
● |
|
Solder Dam( 绿油桥 ) |
4mil |
● |
|
成品塞孔孔径 |
0.2mm |
0.6mm |
|
文字宽度/高度 |
5mil/31.5mil |
● |
|
文字间距(字符到焊盘) |
5mil |
● |
|
喷锡厚度 |
20u" |
1000u" |
|
沉镍厚度 |
80u" |
200u" |
|
电金厚度 |
0.2u" |
● |
|
沉金厚度 |
1u" |
5u" |
|
金手指镍厚 |
100u" |
250u" |
|
金手指金厚 |
1u" |
80u" |
|
OSP(抗氧化)厚度 |
0.2um |
0.5um |
|
CNC公差 |
±0.15mm |
● |
|
PUNCH(模冲)公差 |
±0.1mm |
● |
|
V-CUT余厚公差 |
±0.10mm |
● |
|
V-CUT成型邊距離 |
3mm |
● |
|
BGA球间距 |
有铅20mil/无铅16mil |
● |